Semiconductor device

ABSTRACT

A mask includes a substrate, an effective pixel formation region and a reference pattern formation region. A pixel pattern for forming a pixel component that constitutes a pixel is arranged in the effective pixel formation region. A reference pattern for indicating a reference position where pixel pattern should be arranged in the effective pixel formation region is arranged in the reference pattern formation region. Pixel pattern is arranged to be displaced from the reference position toward a center side of the effective pixel formation region.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.14/079,709, filed Nov. 14, 2013, which is based on and claims priorityunder 35 USC 119 from Japanese Patent Application No. 2012-258646 filedNov. 27, 2012, the disclosures of which are incorporated by referenceherein in their entirety.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a mask and a method for manufacturingthe same, and a semiconductor device. Particularly, the presentinvention relates to a semiconductor device having a so-called shrinkregion, and a method for manufacturing the same.

Description of the Background Art

From the perspective of suppressing displacement of an overlap positionduring the process of overlapping and forming different two patterns inthe formation of a semiconductor device, a pattern for checking anamount of displacement is sometimes used. This pattern includes aso-called slide caliper pattern disclosed in, for example, JapanesePatent Laying-Open No. 10-335205, Japanese Patent Laying-Open No.9-17715, Japanese Patent Laying-Open No. 11-145047, and Japanese PatentLaying-Open No. 2008-205312.

In a CMOS (Complementary Metal Oxide Semiconductor) image sensor, forexample, it is preferable that, in an effective pixel region where aplurality of pixels are arranged, a light blocking film and the likeconstituting the plurality of pixels are arranged to be displaced towarda center side of the effective pixel region, as compared with a lightblocking film and the like in a region outside the effective pixelregion. With such configuration, the light blocking film blocks only thelight to be blocked, such as the light that enters a pixel other than adesired pixel, and the effect of suppressing blockage of the light thatenters the desired pixel is enhanced. As a result, the efficiency of thelight blocking film that blocks the light appropriately is enhanced.

At present, however, there is no established method for indicating, witha high degree of accuracy, a position where the pixel should be arrangedin the effective pixel region. It is conceivable to adopt the idea ofthe slide caliper pattern disclosed in the aforementioned patentdocuments to control the amount of overlap displacement in the formationof the effective pixel region and the region outside the effective pixelregion. However, all of the aforementioned patent documents merelydisclose a method for controlling a relative amount of displacementbetween different two patterns.

Therefore, according to the method disclosed in the aforementionedpatent documents, the aforementioned amount of overlap displacement canbe controlled with a high degree of accuracy, while it is impossible tocheck an amount of displacement from a reference position where each ofthe effective pixel region and the region outside the effective pixelregion should be formed. Specifically, for example, when both of twopatterns are displaced to have the same phase, this can produce theillusion that processing was performed with a very high degree ofoverlap accuracy.

SUMMARY OF THE INVENTION

According to one embodiment, a mask includes: a substrate; an effectivepixel formation region; and a reference pattern formation region. Areference pattern for indicating a reference position where the pixelpattern should be arranged in the effective pixel formation region isarranged in the reference pattern formation region. The pixel pattern isarranged to be displaced from the reference position toward a centerside of the effective pixel formation region.

According to another embodiment, a semiconductor device includes: asemiconductor substrate; an effective pixel region; and a referenceportion arrangement region. A reference portion for indicating areference position where the pixel component should be arranged in theeffective pixel region is arranged in the reference portion arrangementregion. The pixel component is arranged to be displaced from thereference position toward a center side of the effective pixel region.

According to a method for manufacturing a mask in still anotherembodiment, a substrate having a main surface is first prepared. Firstdata drawn on a first layer is prepared, the first data being fordrawing a pixel pattern in an effective pixel formation region on themain surface of the substrate where the pixel pattern is formed, thepixel pattern being for forming a pixel component that constitutes apixel. Second data drawn on a second layer different from the firstlayer is prepared, the second data being for drawing a reference patternin a reference pattern formation region which surrounds the effectivepixel formation region and where the reference pattern is formed, thereference pattern being for indicating a reference position where thepixel pattern should be arranged in the effective pixel formationregion. By using the first data, drawing is performed. By using thesecond data, the reference pattern is drawn in the reference patternformation region.

According to a method for manufacturing a mask in a further embodiment,a substrate having a main surface is first prepared. First data fordrawing a pixel pattern in an effective pixel formation region isprepared. Second data for drawing a reference pattern in a referencepattern formation region which surrounds the effective pixel formationregion and where the reference pattern is formed is prepared, thereference pattern being for indicating a reference position where thepixel pattern should be arranged in the effective pixel formationregion. Identification data for distinguishing between the effectivepixel formation region and the reference pattern formation region isprepared. By using the first data, drawing is performed, with theidentification data superimposed on the first data. By using the seconddata, the reference pattern is drawn in the reference pattern formationregion.

According to a method for manufacturing a mask in a further embodiment,a substrate is first prepared similarly to the aforementioned method formanufacturing a mask. First data drawn in a first cell, for drawing apixel pattern in an effective pixel formation region is prepared. Seconddata drawn in a second cell, for drawing a reference pattern in areference pattern formation region is prepared. By using the seconddata, the reference pattern is drawn in the reference pattern formationregion. The first cell and the second cell are drawn on the same layer.

According to a method for manufacturing a mask in a further embodiment,a substrate is first prepared similarly to the aforementioned method formanufacturing a mask. Coordinate ranges, on the main surface of thesubstrate, of an effective pixel formation region and a referencepattern formation region are specified. First data for drawing the pixelpattern in the effective pixel formation region and second data fordrawing the reference pattern in the reference pattern formation regionare prepared. By using the first data, drawing is performed, whileidentifying the coordinate range. By using the second data, thereference pattern is drawn in the reference pattern formation region,while identifying the coordinate range.

According to one embodiment, there can be provided a mask in which anamount of displacement of the pixel pattern from the reference positioncan be controlled with a higher degree of accuracy by using thereference pattern.

According to another embodiment, there can be provided a semiconductordevice in which an amount of displacement of the pixel component fromthe reference position can be controlled with a higher degree ofaccuracy by using the reference portion.

According to a method for manufacturing a mask in still anotherembodiment, there can be provided a mask in which an amount ofdisplacement of the pixel pattern from the reference position can becontrolled with a higher degree of accuracy by using the referencepattern. A method for manufacturing a mask in other embodiments producesthe effect basically similar to that of the aforementioned method formanufacturing a mask.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a mask according to a firstembodiment.

FIG. 2 is a schematic plan view for describing positional displacementof an effective pixel formation region from a reference patternformation region of the mask according to the first embodiment.

FIG. 3 is a schematic plan view of a semiconductor chip formed by usingthe mask according to the first embodiment.

FIG. 4 is a schematic cross-sectional view showing a manner of lightentering an effective pixel region of the semiconductor chip.

FIG. 5 is a schematic plan view of a first example of a mask accordingto a second embodiment.

FIG. 6 is a schematic plan view of a second example of the maskaccording to the second embodiment.

FIG. 7 is a schematic plan view for describing positional displacementof an effective pixel formation region from a reference patternformation region of the mask according to the second embodiment (FIG.5).

FIG. 8 is a schematic plan view of a third example of the mask accordingto the second embodiment.

FIG. 9 is a schematic plan view of a semiconductor chip formed by usingthe mask according to the second embodiment (FIG. 5).

FIG. 10 is a schematic plan view for describing layers for forming themask according to the first embodiment, which are used in amanufacturing method according to a third embodiment.

FIG. 11 is a schematic plan view for describing layers for forming themask according to the second embodiment, which are used in themanufacturing method according to the third embodiment.

FIG. 12 is a flowchart for describing the manufacturing method accordingto the third embodiment.

FIG. 13 is a schematic plan view for describing layers for forming themask according to the first embodiment, which are used in amanufacturing method according to a fourth embodiment.

FIG. 14 is a schematic plan view for describing layers for forming themask according to the second embodiment, which are used in themanufacturing method according to the fourth embodiment.

FIG. 15 is a flowchart for describing the manufacturing method accordingto the fourth embodiment.

FIG. 16 is a schematic plan view for describing cells for forming themask according to the first embodiment, which are used in amanufacturing method according to a fifth embodiment.

FIG. 17 is a schematic plan view for describing cells for forming themask according to the second embodiment, which are used in themanufacturing method according to the fifth embodiment.

FIG. 18 is a flowchart for describing the manufacturing method accordingto the fifth embodiment.

FIG. 19 is a schematic plan view for describing layers for forming themask according to the first embodiment, which are used in amanufacturing method according to a sixth embodiment.

FIG. 20 is a schematic plan view for describing layers for forming themask according to the second embodiment, which are used in themanufacturing method according to the sixth embodiment.

FIG. 21 is a flowchart for describing the manufacturing method accordingto the sixth embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

One embodiment will be described hereinafter with reference to thedrawings.

(First Embodiment)

A configuration of a mask used in processing of a semiconductor deviceaccording to one embodiment will be described first with reference toFIGS. 1 and 2.

Referring to FIG. 1, a mask MSK according to the embodiment is, forexample, a mask used to form a CMOS image sensor. Mask MSK is, forexample, used to form a light blocking film, an inner lens or a thinfilm of a color filter that constitutes a pixel such as a photodiodeformed in the CMOS image sensor.

Mask MSK has such a configuration that a plurality of patterns forforming the aforementioned light blocking film, inner lens, color filteror the like are arranged on one main surface of a substrate SB made of agenerally known material (such as glass).

Specifically, the main surface of mask MSK is a so-called pixelformation region, which is a region for forming a pixel region of theCMOS image sensor. The pixel formation region has an effective pixelformation region and a reference pattern formation region.

Effective pixel formation region is a region for forming an effectivepixel region where an actual pixel constituting the CMOS image sensor isformed. When mask MSK has, for example, a rectangular planar shape, theeffective pixel formation region is arranged in a central portion of themain surface of the rectangle.

The reference pattern formation region is arranged to surround theeffective pixel formation region on the main surface of substrate SB,that is, is arranged at an outer perimeter portion of the effectivepixel formation region on the main surface of substrate SB. Boundarylines BL1 m, BL2 m, BL3 m, and BL4 m as an outer perimeter line of theeffective pixel formation region serve as a boundary between theeffective pixel formation region and the reference pattern formationregion. The effective pixel formation region is arranged to besurrounded by a rectangle forming these boundary lines BL1 m to BL4 m,and the reference pattern formation region is arranged outside theseboundary lines BL1 m to BL4 m.

A plurality of pixel patterns PTN1 m are arranged in the effective pixelformation region. Here, a plurality of patterns for forming a pixelcomponent such as, for example, the light blocking film that constitutesa pixel are arranged in rows and columns as pixel patterns PTN1 m. Thesepatterns are made of a generally known material (such as chromium). Thepixel component of the CMOS image sensor is formed by these pixelpatterns PTN1 m.

A plurality of non-pixel patterns PTN2 m are arranged in the referencepattern formation region. Non-pixel patterns PTN2 m are patterns otherthan pixel patterns PTN1 m and are patterns for forming a component(e.g., a reference portion and the like described below) other than thepixel component.

Non-pixel patterns PTN2 m are arranged in a region that faces theneighborhood of opposing ends of each of boundary lines BL1 m to BL4 m.In other words, a group of non-pixel patterns PTN2 m is arranged at twolocations in the region that faces each of boundary lines BL1 m to BL4m, and the group of non-pixel patterns PTN2 m is arranged at a total ofeight locations.

Each group of non-pixel patterns PTN2 m is formed by one referencepattern PTN21 m to PTN28 m and a plurality of (in the presentembodiment, five) dummy formation patterns DMm.

Reference patterns PTN21 m and PTN22 m are arranged in the region thatfaces boundary line BL1 m. Reference patterns PTN23 m and PTN24 m arearranged in the region that faces boundary line BL2 m. Referencepatterns PTN25 m and PTN26 m are arranged in the region that facesboundary line BL3 m. Reference patterns PTN27 m and PTN28 m are arrangedin the region that faces boundary line BL4 m. In other words, referencepatterns PTN21 m to PTN28 m are arranged to face pixel patterns PTN1 mwith boundary lines BL1 m to BL4 m of the effective pixel formationregion interposed therebetween.

In FIG. 1, a spacing between pixel patterns PTN1 m in the effectivepixel formation region is substantially equal to a spacing betweennon-pixel patterns PTN2 m in the reference pattern formation region. Allof pixel patterns PTN1 m and non-pixel patterns PTN2 m have the samesize in plan view, and pixel pattern PTN1 m and non-pixel pattern PTN2 mthat face each other with each of boundary lines BL1 m to BL4 minterposed therebetween are arranged to be flush with each other (tohave an equal coordinate in the direction along each of boundary linesBL1 m to BL4 m).

For example, reference pattern PTN21 m and pixel pattern PTN1 m (pixelpattern PTN11 m) that faces reference pattern PTN21 m with boundary lineBL1 m interposed therebetween are arranged to have an equal coordinatein the horizontal direction in the figure along boundary line BL1 m.Pixel pattern PTN11 m (reference pattern PTN21 m) is arranged, forexample, at a position of the second from the left end of nine pixelpatterns PTN1 m lined in the horizontal direction in FIG. 1. The same isapplied as well to other reference patterns PTN22 m to PTN28 m. Each ofreference patterns PTN22 m to PTN28 m is arranged, for example, at aposition having a coordinate equal to that of the second row (or column)from the row (or column) end of pixel patterns PTN1 m.

Actually, however, the spacing between adjacent pixel patterns PTN1 m isnot equal to the spacing between adjacent non-pixel patterns PTN2 m (inthe row direction or column direction in the figure). Specifically,referring to FIG. 2, pixel patterns PTN1 m as a whole are arranged to bedisplaced from non-pixel patterns PTN2 m toward a center side (to beconcentrated on the center side) of the effective pixel formationregion. In other words, the spacing between a pair of adjacent pixelpatterns PTN1 m is shorter than the spacing between a pair of adjacentnon-pixel patterns PTN2 m. As a result, for example, reference patternPTN21 m and pixel pattern PTN11 m that faces reference pattern PTN21 mwith boundary line BL1 m interposed therebetween have differentcoordinates in the horizontal direction in the figure along boundaryline BL1 m.

Reference pattern PTN21 m to PTN28 m is arranged to indicate a referenceposition where pixel pattern PTN11 m to PTN18 m in the effective pixelformation region, which faces reference pattern PTN21 m to PTN28 m withboundary line BL1 m to BL4 m interposed therebetween, should be arrangedin the direction along boundary line BL1 m to BL4 m. Specifically, forexample, reference pattern PTN21 m is arranged at a position equal tothe reference position where pixel pattern PTN11 m should be arranged inthe horizontal direction in the figure along boundary line BL1 m. Here,the reference position where the pixel pattern should be arranged refersto a position where pixel pattern PTN1 m is arranged when it is notnecessary to take into consideration positional displacement of pixelpattern PTN1 m in the effective pixel formation region from non-pixelpattern PTN2 m (that faces pixel pattern PTN1 m with the boundary lineinterposed therebetween) (when there is no displacement of pixel patternPTN1 m). Therefore, each of pixel patterns PTN11 m to PTN18 m in FIG. 1is displaced and arranged to be concentrated on the center side withrespect to the reference position where each of pixel patterns PTN11 mto PTN18 m should exist (position where each of reference patterns PTN21m to PTN28 m is arranged).

In the reference pattern formation region, dummy formation patterns DMmare formed around each of reference patterns PTN21 m to PTN28 m to bespaced apart from each of reference patterns PTN21 m to PTN28 m. Here,dummy formation patterns DMm are arranged in a first direction (e.g.,the row direction in the figure), a second direction (e.g., the columndirection in the figure) and a third direction (e.g., the obliquedirection of about 45° in the figure) of reference patterns PTN21 m toPTN28 m in plan view. Each of reference patterns PTN21 m to PTN28 m isarranged such that a spacing, in a direction intersecting with boundarylines BL1 m to BL4 m, between each of reference patterns PTN21 m toPTN28 m and each of pixel patterns PTN11 m to PTN18 m that faces each ofreference patterns PTN21 m to PTN28 m with boundary lines Bilm to BL4 minterposed therebetween is substantially equal to the spacing between apair of adjacent pixel patterns PTN1 m. Therefore, there is no space fordummy formation pattern DMm in a portion of each of reference patternsPTN21 m to PTN28 m on the boundary line Bilm to BL4 m side, and dummyformation pattern DMm is not arranged. As a result, five dummy formationpatterns DMm are arranged around each reference pattern. The presentinvention is not, however, limited thereto and a larger number of dummyformation patterns DMm may be arranged.

A spacing between dummy formation patterns DMm and the reference patternin the aforementioned first or second direction is longer than a spacingbetween a pair of adjacent pixel patterns PTN1 m in the aforementionedfirst or second direction, and is the same as the spacing when pixelpattern PTN1 m is arranged not to be displaced from the referencepattern.

The positional displacement of pixel patterns PTN11 m to PTN18 m fromreference patterns PTN21 m to PTN28 m occurs due to the following twofactors. The first factor is that pixel patterns PTN1 m as a whole arearranged to be displaced from non-pixel patterns PTN2 m toward thecenter side of the effective pixel formation region as described above.Since pixel patterns PTN1 m as a whole are arranged to come closer tothe center side of the effective pixel formation region, the spacingbetween pixel patterns PTN1 m is shorter than the spacing betweennon-pixel patterns PTN2 m.

Since the plurality of pixel patterns PTN1 m as a whole are arranged tobe displaced toward the center side of the effective pixel formationregion, the effective pixel formation region appears to shrink towardthe center side of the main surface of substrate SB, as compared withthe case in which pixel patterns PTN1 m are not displaced toward thecenter side as described above. Therefore, in the following description,the state in which pixel patterns PTN1 m are concentrated on the centerside will be referred to as “shrink”.

The second factor of the positional displacement is that, due to theaccuracy in processing, an error occurs with respect to the position ofnon-pixel patterns PTN2 m when pixel patterns PTN1 m in the effectivepixel formation region are formed. This is caused by various factorssuch as manual operation and dimensional accuracy of facilities. Due toa combination of these factors, a point whose original position is c1 isdisplaced to c2 by z in the right direction in the figure in theeffective pixel formation region, for example, as shown in FIG. 2.

In addition, as shown in FIG. 2, a left-side edge of pixel pattern PTN11m is displaced from reference pattern PTN21 m by a in the rightdirection in the figure, and a right-side edge of pixel pattern PTN12 mis displaced from reference pattern PTN22 m by b in the right directionin the figure.

Assume that L represents a distance between a left-side edge ofreference pattern PTN21 m and a right-side edge of reference patternPTN22 m in the horizontal direction in the figure. Then, assuming that Srepresents a shrink rate, the following equations are obtained:

$\begin{matrix}{a = {{\frac{L}{2} \cdot S} + z}} & (1) \\{b = {{\frac{L}{2} \cdot S} - {z.}}} & (2)\end{matrix}$

These equations are derived by combining the aforementioned two factorsof the positional displacement.

Based on the aforementioned equations, shrink rate S is expressed by thefollowing equation:

$\begin{matrix}{S = {\frac{a + b}{L}.}} & (3)\end{matrix}$

An amount of displacement z is expressed by the following equation:

$\begin{matrix}{z = {\frac{a - b}{2}.}} & (4)\end{matrix}$

To simplify the figure, pixel pattern PTN1 m and non-pixel pattern PTN2m (reference patterns PTN21 m to PTN28 m and dummy formation patternsDMm) have a rectangular planar shape. The present invention is not,however, limited thereto and these patterns may have any planar shapes.

Referring to FIG. 3, a semiconductor chip CHP according to theembodiment is the CMOS image sensor as a semiconductor device formed byusing mask MSK in FIGS. 1 and 2. Semiconductor chip CHP is arranged onone main surface of a semiconductor substrate SUB made of a generallyknown material (e.g., single crystal of silicon).

The one main surface of semiconductor substrate SUB has a pixel regionand a peripheral circuit region. The pixel region is a main portion ofsemiconductor chip CHP where a pixel such as a photodiode of the CMOSimage sensor is arranged. When semiconductor chip CHP has, for example,a rectangular planar shape, the pixel region is arranged in a centralportion of the main surface of the rectangle.

The peripheral circuit region is, for example, a region where a circuitfor input/output and the like of an electrical signal from/to a circuitexternal to semiconductor chip CHP is arranged. The peripheral circuitregion is arranged to surround the pixel region on the main surface ofsemiconductor substrate SUB, that is, is arranged at an outer perimeterportion of the pixel region on the main surface of semiconductorsubstrate SUB. Boundary lines B1 c, B2 c, B3 c, and B4 c as an outerperimeter line of the pixel region serve as a boundary between the pixelregion and the peripheral circuit region. The pixel region is arrangedto be surrounded by a rectangle forming these boundary lines B1 c to B4c, and the peripheral circuit region is arranged outside these boundarylines B1 c to B4 c.

The pixel region has an effective pixel region and a reference portionarrangement region. When the pixel region has, for example, arectangular planar shape, the effective pixel region is arranged in acentral portion of the main surface of the rectangle. The effectivepixel region is a main portion of the pixel region having an effectivefunction as a photodiode that converts the light absorbed by the pixelinto an electrical signal.

The reference portion arrangement region is arranged to surround theeffective pixel region on the main surface of the pixel region, that is,is arranged at an outer perimeter portion of the effective pixel regionon the main surface of semiconductor substrate SUB. Boundary lines BL1c, BL2 c, BL3 c, and BL4 c as an outer perimeter line of the effectivepixel region serve as a boundary between the effective pixel region andthe reference portion arrangement region. The effective pixel region isarranged to be surrounded by a rectangle forming these boundary linesBL1 c to BL4 c, and the reference portion arrangement region is arrangedoutside these boundary lines BL1 c to BL4 c.

A plurality of pixel components PTN1 c are arranged in the effectivepixel region. Pixel components PTN1 c are pixel components such as thelight blocking film, the inner lens and the color filter formed by pixelpattern PTN1 m of mask MSK. The plurality of pixel components PTN1 c arearranged in rows and columns, similarly to pixel patterns PTN1 m.

A photodiode PD as the pixel is arranged in the effective pixel regionin FIG. 3. By way of example, photodiode PD is shown at a positionsandwiched between a pair of pixel components PTN1 c arranged in rowsand columns. This is, however, for simplification of the figure and theconfiguration of photodiode PD is not limited thereto.

A plurality of non-pixel components PTN2 c are arranged in the referenceportion arrangement region. Although non-pixel components PTN2 c arearranged as the same layer as that of pixel components PTN1 c, non-pixelcomponents PTN2 c are components that are not the pixel components.

Non-pixel components PTN2 c are arranged in a region that faces theneighborhood of opposing ends of each of boundary lines BL1 c to BL4 c.In other words, a group of non-pixel components PTN2 c is arranged attwo locations in the region that faces each of boundary lines BL1 c toBL4 c, and the group of non-pixel components PTN2 c is arranged at atotal of eight locations.

Each group of non-pixel components PTN2 c is formed by one referenceportion PTN21 c to PTN28 c and a plurality of (in the presentembodiment, five) dummy structures DMc. Reference portions PTN21 c toPTN28 c are formed by reference patterns PTN21 m to PTN28 m, and dummystructure DMc is formed by dummy formation pattern DMm.

As described above, pixel component PTN1 c is formed by pixel patternPTN1 m of mask MSK, and non-pixel component PTN2 c is formed bynon-pixel pattern PTN2 m of mask MSK. Therefore, pixel component PTN1 cand non-pixel component PTN2 c have a configuration basically similar tothat of pixel pattern PTN1 m and non-pixel pattern PTN2 m.

Specifically, pixel components PTN1 c (including pixel components PTN11c to PTN18 c) as a whole are arranged to be displaced from non-pixelcomponents PTN2 c toward the center side of the effective pixel region,that is, are arranged to shrink. On the other hand, particularlyreference portions PTN21 c to PTN28 c of non-pixel component PTN2 c arearranged to face pixel components PTN11 c to PTN18 c in the effectivepixel region with boundary lines BL1 c to BL4 c interposed therebetween,respectively. Reference portion PTN21 c to PTN28 c is arranged toindicate a reference position where pixel component PTN11 c to PTN18 cin the effective pixel region should be arranged in the direction alongboundary line BL1 m to BL4 m.

In the reference portion arrangement region, dummy structures DMc areformed around each of reference portions PTN21 c to PTN28 c to be spacedapart from each of reference portions PTN21 c to PTN28 c.

The remaining configuration of each portion of pixel component PTN1 cand non-pixel component PTN2 c is basically similar to that of eachportion of pixel pattern PTN1 m and non-pixel pattern PTN2 m describedabove.

To simplify the figure, pixel component PTN1 c and non-pixel componentPTN2 c (reference portions PTN21 c to PTN28 c and dummy structures DMc)have a rectangular planar shape. The present invention is not, however,limited thereto and these patterns may have any planar shapes.

Next, the function and effect of the embodiment will be described.First, with reference to FIG. 4, description will be given to the reasonwhy the patterns and the like are shrunk in the effective pixel(formation) region of mask MSK and semiconductor chip CHP according tothe embodiment.

Referring to FIG. 4, the light from directly above a lens LNS arrangedabove semiconductor chip CHP, which enters particularly photodiode PD(effective pixel region) of semiconductor chip CHP (CMOS image sensor)through lens LNS, for example, passes through lens LNS as describedbelow. The light passing through a central portion of lens LNS entersphotodiode PD in a central portion of the effective pixel region, withlittle refraction by lens LNS. In contrast, the light entering lens LNSfrom an end of lens LNS is refracted by lens LNS and travels in thedirection having a large angle with respect to the vertical direction inFIG. 4. As described above, as a distance between the position where thelight enters lens LNS and the central portion of lens LNS becomeslonger, the light is refracted by lens LNS more greatly.

The light blocking film is arranged above each photodiode PD arranged inthe effective pixel region. This light blocking film suppresses thelight that unintentionally enters photodiode PD arranged next to desiredphotodiode PD on the main surface of semiconductor chip CHP, and isshown as a light blocking film PTN in FIG. 4. For example, pixelcomponent PTN1 c in FIG. 3 corresponds to light blocking film PTN inFIG. 4. Therefore, light blocking film PTN may be arranged, for example,in a region adjacent to photodiode PD in plan view.

However, if the incident light is greatly refracted due to the functionof lens LNS as described above, light blocking film PTN may block notonly the light to be blocked but also a part of the light that shouldenter desired photodiode PD, particularly at an end of the effectivepixel region.

In order to solve the aforementioned problem, light blocking film PTN insemiconductor chip CHP is preferably shrunk toward the center side inplan view in the effective pixel region. With such configuration, lightblocking film PTN is not arranged in a relatively outer portion of theeffective pixel region in plan view, and thus, there can be reduced apossibility that the light refracted greatly by lens LNS at the end ofthe effective pixel region is unintentionally blocked by light blockingfilm PTN. For the aforementioned reason, pixel pattern PTN1 m of maskMSK and pixel component PTN1 c of semiconductor chip CHP are shrunk asabove.

However, if it is impossible to grasp, with a high degree of accuracy,an amount of displacement of pixel pattern PTN1 m of mask MSK due toshrink from the reference position where pixel pattern PTN1 m should bearranged, for example, it is difficult to control the amount ofdisplacement with a high degree of accuracy. Until now, however, therehas not been established means for indicating the reference positionwhere the pixel pattern should be arranged.

Thus, in the embodiment, reference patterns PTN21 m to PTN28 mindicating the reference position in the case of no shrink are provided.Since reference patterns PTN21 m to PTN28 m can be formed without takingshrink into consideration, reference patterns PTN21 m to PTN28 m can beeasily formed in accordance with the ordinary design specifications.Therefore, by measuring the positional displacement of pixel patternsPTN11 m to PTN18 m from reference patterns PTN21 m to PTN28 m, theamount of displacement of pixel patterns PTN11 m to PTN18 m from thereference position can be grasped with a high degree of accuracy and theamount of displacement can be controlled to have a desired value.

Reference patterns PTN21 m to PTN28 m are arranged to face pixelpatterns PTN11 m to PTN18 m with boundary lines BL1 m to BL4 minterposed therebetween, respectively. Reference patterns PTN21 m toPTN28 m indicate the reference position where pixel patterns PTN11 m toPTN18 m should be arranged in the direction along boundary line BL.Since a distance between pixel patterns PTN11 m to PTN18 m and referencepatterns PTN21 m to PTN28 m is short, the position of pixel patternsPTN11 m to PTN18 m can be grasped more accurately.

In the embodiment, dummy formation patterns DMm are arranged to surroundeach of reference patterns PTN21 m to PTN28 m. Therefore, there can bereduced a possibility that the shape of reference patterns PTN21 m toPTN28 m changes due to the optical proximity effect, the micro-loadingeffect and the like when reference patterns PTN21 m to PTN28 m areformed by patterning.

In other words, as for the pattern that exists at the end in plan viewand does not have the dummy pattern therearound, there is a possibilitythat the shape of the pattern changes due to the optical proximityeffect, the micro-loading effect and the like. However, dummy formationpatterns DMm surround each of reference patterns PTN21 m to PTN28 mhaving an important role to indicate the reference position in mask MSK,and thus, reference patterns PTN21 m to PTN28 m can be arranged in thecentral portion in plan view. With such configuration, surrounding dummyformation patterns DMm play a role to protect against damage toreference patterns PTN21 m to PTN28 m, and thus, the change in shape ofreference patterns PTN21 m to PTN28 m can be suppressed.

As described above, there is no space for dummy formation pattern DMm inthe portion of each of reference patterns PTN21 m to PTN28 m on theboundary line BL1 m to BL4 m side, and dummy formation pattern DMm isnot arranged. However, in the portion of each of reference patternsPTN21 m to PTN28 m on the boundary line BL1 m to BL4 m side, pixelpattern PTN1 m having a configuration similar to that of referencepatterns PTN21 m to PTN28 m is arranged in the effective pixel formationregion beyond boundary lines BL1 m to BL4 m. In other words, each ofreference patterns PTN21 m to PTN28 m has this pixel pattern PTN1 m inthe direction on the boundary line BL1 m to BL4 m side. Since this pixelpattern PTN1 m functions similarly to dummy formation pattern DMm, theaforementioned effect of suppressing the change in shape of referencepatterns PTN21 m to PTN28 m can be further enhanced.

In addition, because of the configuration similar to that ofaforementioned mask MSK in semiconductor chip CHP, the function andeffect similar to those of aforementioned mask MSK are produced.

(Second Embodiment)

The present embodiment is different from the first embodiment in termsof the planar shape of the reference pattern and the reference portion.A configuration of a mask according to the present embodiment will bedescribed first with reference to FIGS. 5 and 6.

Referring to FIG. 5, mask MSK according to the present embodiment has aconfiguration basically similar to that of mask MSK according to thefirst embodiment. However, in mask MSK in FIG. 5, non-pixel pattern PTN2m arranged in the reference pattern formation region has an arrow-like(wedge-like) planar shape.

Specifically, non-pixel patterns PTN2 m are arranged in a region thatfaces the neighborhood of opposing ends of each of boundary lines BL1 mto BL4 m. Two non-pixel patterns PTN2 m are arranged in the region thatfaces each of boundary lines BL1 m to BL4 m, and a total of eightnon-pixel patterns PTN2 m are arranged. However, only one referencepattern PTN21 m to PTN28 m is arranged in each non-pixel pattern PTN2 m.Therefore, in mask MSK in FIG. 5, dummy formation pattern DMm is notarranged. However, a position where each of reference patterns PTN21 mto PTN28 m is arranged in mask MSK in FIG. 5 is the same as that in maskMSK in FIG. 1. Specifically, each of reference patterns PTN21 m to PTN28m is arranged at the position having a coordinate equal to that of thesecond row (or column) from the row (or column) end of pixel patternsPTN1 m.

Reference pattern PTN2 m (PTN21 m to PTN28 m) has a planar shape that issymmetric with respect to an imaginary straight line 1 as a symmetricline extending perpendicularly to each of boundary lines BL1 m to BL4 mon the main surface of substrate SB of mask MSK. The wedge-like planarshape of reference patterns PTN21 m to PTN28 m in FIG. 5 is used as oneexample of the shape that satisfies the aforementioned symmetrycondition. Therefore, referring to FIG. 6, for example, referencepatterns PTN21 m to PTN28 m in the present embodiment may have a rhombicplanar shape, instead of the wedge-like shape shown in FIG. 5. In thiscase as well, these rhombic reference patterns PTN21 m to PTN28 m have aplanar shape that is symmetric with respect to an imaginary straightline as a symmetric line extending perpendicularly to each of boundarylines BL1 m to BL4 m.

In FIGS. 5 and 6, shrink of pixel pattern PTN11 m in the effective pixelformation region and positional displacement in the effective pixelformation region are not taken into consideration. Actually, however,referring to FIG. 7, similarly to the first embodiment, pixel patternsPTN1 m as a whole are arranged to be displaced from non-pixel patternsPTN2 m toward the center side (to be concentrated on the center side) ofthe effective pixel formation region in the present embodiment as well.

Actually, shrink and positional displacement shown in FIG. 7 exist alsoin rhombic reference patterns PTN21 m to PTN28 m in FIG. 6, althoughthis is not shown.

Assume that L represents a distance between a central portion (imaginarystraight line 1) of reference pattern PTN21 m and a central portion(imaginary straight line 1) of reference pattern PTN22 m in thehorizontal direction in the figure. At this time, assuming that Srepresents a shrink rate, a distance a0 between the central portion ofreference pattern PTN21 m and a central portion of pixel pattern PTN11 mis expressed by the following equation:

$\begin{matrix}{{a\; 0} = {\frac{{a\; 1} + {a\; 2}}{2}.}} & (5)\end{matrix}$

A distance b0 between the central portion of reference pattern PTN22 mand a central portion of pixel pattern PTN12 m is expressed by thefollowing equation:

$\begin{matrix}{{b\; 0} = {\frac{{b\; 1} + {b\; 2}}{2}.}} & (6)\end{matrix}$

In the aforementioned equations, al represents a distance between thecentral portion of reference pattern PTN21 m and an edge of pixelpattern PTN11 m, and b1 represents a distance between the centralportion of reference pattern PTN22 m and an edge of pixel pattern PTN12m.

In FIGS. 5 to 7, dummy formation pattern DMm is not arranged. However,referring to FIG. 8, similarly to the first embodiment, dummy formationpatterns DMm may be arranged to surround each of reference patternsPTN21 m to PTN28 m in the present embodiment as well.

Referring to FIG. 9, semiconductor chip CHP according to the presentembodiment formed by using mask MSK in FIG. 5 has a configurationbasically similar to that of semiconductor chip CHP according to thefirst embodiment. However, in semiconductor chip CHP in FIG. 9,non-pixel component PTN2 c (reference portions PTN21 c to PTN28 c)arranged in the reference portion arrangement region has an arrow-like(wedge-like) planar shape. Since semiconductor chip CHP in FIG. 9 isformed by using mask MSK in FIG. 5, pixel component PTN1 c and non-pixelcomponent PTN2 c have a configuration basically similar to that of pixelpattern PTN1 m and non-pixel pattern PTN2 m. Semiconductor chip CHPaccording to the present embodiment may, for example, have rhombicnon-pixel component PTN2 c (reference portions PTN21 c to PTN28 c)formed by using mask MSK in FIG. 6.

Next, the function and effect of the present embodiment will bedescribed.

Non-pixel pattern PTN2 m of mask MSK according to the present embodimenthas a planar shape that is symmetric with respect to imaginary straightline 1 as a symmetric line extending perpendicularly to each of boundarylines BL1 m to BL4 m. In other words, in non-pixel pattern PTN2 m, thepattern is arranged over the same distance on both of the right and leftsides of imaginary straight line 1 in the direction perpendicular toimaginary straight line 1. Therefore, in non-pixel pattern PTN2 m in thepresent embodiment, the optical proximity effect and the micro-loadingeffect affect both of the right and left sides of imaginary straightline 1 in substantially the same manner. Therefore, in non-pixel patternPTN2 m in the present embodiment, deformation and the like caused by theoptical proximity effect and the micro-loading effect occur in theopposite directions in both of the right and left sides of imaginarystraight line 1.

Therefore, even if the shape changes due to the optical proximity effectand the like on the right and left sides of imaginary straight line 1 ofnon-pixel pattern PTN2 m, the change in shape on the left side ofimaginary straight line 1 and the change in shape on the right side ofimaginary straight line 1 are canceled out and the change in shape andposition does not occur in imaginary straight line 1 that is the centralportion of non-pixel pattern PTN2 m. In other words, at least imaginarystraight line 1 is secured at a desired position, and thereby, aposition of a tip (pointed portion) of wedge-shaped non-pixel patternPTN2 m shown in FIG. 5 and rhombic non-pixel pattern PTN2 m shown inFIG. 6, for example, has high reliability as the reference position. Byusing this position, the positional displacement of pixel patterns PTN11m to PTN18 m from reference patterns PTN21 m to PTN28 m can be measuredwith a high degree of accuracy.

As described above, in the present embodiment, at least the position ofnon-pixel pattern PTN2 m on imaginary straight line 1 may only besecured, and there is no problem even if deformation and the like occurin non-pixel pattern PTN2 m in a region other than the region onimaginary straight line 1. Therefore, as shown in FIG. 5 and the like,dummy formation pattern DMm does not need to be arranged for a group ofnon-pixel pattern PTN2 m in the present embodiment. However, when thegroup of non-pixel pattern PTN2 m in the present embodiment is formed byone reference pattern PTN21 m to PTN28 m and a plurality of (in thepresent embodiment, five) dummy formation patterns DMm as shown in FIG.8, similarly to the first embodiment, deformation of reference patternPTN21 m can be suppressed, and thus, the reference position can beindicated with a higher degree of accuracy.

In addition, because of the configuration similar to that ofaforementioned mask MSK in semiconductor chip CHP, the function andeffect similar to those of aforementioned mask MSK are produced.

(Third Embodiment)

A first method for manufacturing mask MSK according to the first andsecond embodiments is as described below. In particular, a design(layout) method on a CAD will now be described.

Referring to FIGS. 10 and 11, in the present embodiment, a layer that isa collection of data on the CAD for forming the effective pixelformation region (and the pattern thereof) on mask MSK and a layer onthe CAD for forming the reference pattern formation region (and thepattern thereof) on mask MSK are prepared separately.

In other words, the layer for forming the effective pixel formationregion corresponds to a layer LYR1 in a shrink region, and the layer forforming the reference pattern formation region corresponds to a layerLYR2 in a non-shrink region. This is because pixel pattern PTN1 m formedin the effective pixel formation region is shrunk, whereas non-pixelpattern PTN2 m formed in the reference pattern formation region is notshrunk.

The layer in the shrink region includes pixel data PTN1 for formingpixel pattern PTN1 m (including pixel patterns PTN11 m to PTN18 m), andpixel data PTN1 includes pixel data PTN11 to PTN18. Pixel data PTN11 toPTN18 correspond to data for forming pixel patterns PTN11 m to PTN18 m,respectively.

The layer in the non-shrink region includes non-pixel pattern PTN2 m,i.e., reference patterns PTN21 m to PTN28 m, and non-pixel data PTN2 forforming dummy formation pattern DMm, and non-pixel data PTN2 includesdata for forming reference data PTN21 to PTN28 and dummy formationpattern DMm. Reference data PTN21 to PTN28 correspond to data forforming reference patterns PTN21 m to PTN28 m, respectively.

Both of mask MSK in FIG. 1 (first embodiment) as shown in FIG. 10 andmask MSK in FIG. 5 (second embodiment) as shown in FIG. 11 can be formedby using the two layers of the layer in the shrink region and the layerin the non-shrink region as in the present embodiment.

In order to facilitate imagining the collection of data existing onlayers LYR1 and LYR2, each data is shown to be arranged in rows andcolumns similarly to mask MSK and the like.

Next, the method for manufacturing mask MSK according to the presentembodiment (design method using the CAD) will be described withreference to FIG. 12.

Referring to FIG. 12, substrate SB for the mask is first prepared (S00).Next, prepared are a first layer where the data (first data) in theshrink region can collect, and a second layer where the data (seconddata) in the non-shrink region can collect, as shown in FIGS. 10 and 11(S10).

Next, drawn on the first layer is shrink data PTN1 (first data) fordrawing pixel pattern PTN1 m in the effective pixel formation regionwhere pixel pattern PTN1 m for forming pixel component PTN1 c (refer toFIGS. 3 and 9) is formed (S20).

Next, drawn on the second layer is non-shrink data PTN2 (second data)for drawing reference patterns PTN21 m to PTN28 m in the referencepattern formation region where reference patterns PTN21 m to PTN28 m(for forming reference portions PTN21 c to PTN28 c) are formed,reference patterns PTN21 m to PTN28 m being for indicating the referenceposition where pixel pattern PTN1 m should be arranged (S30).

To put it more briefly, first data PTN1 (PTN11 to PTN18) that is thedata in the shrink region is drawn on the first layer that is the layerin the shrink region, and second data PTN2 (PTN21 to PTN28) that is thedata in the non-shrink region is drawn on the second layer that is thelayer in the non-shrink region. Second data PTN2 herein includes thedata for forming dummy formation pattern DMm.

The order of the step (S20) and the step (S30) does not matter. The step(S30) may be performed prior to the step (S20), or the step (S20) andthe step (S30) may be performed simultaneously.

Next, by using the first data that is the data in the shrink region,pixel pattern PTN1 m (PTN11 m to PTN18 m) is drawn on substrate SB ofthe mask (S40). At this time, pixel pattern PTN1 m is controlled toshrink to be displaced toward the center side of the effective pixelformation region from the position where pixel pattern PTN1 m should bearranged in the case of no shrink (S41).

Next, by using the second data that is the data in the non-shrinkregion, non-pixel pattern PTN2 m (reference patterns PTN21 m to PTN28 mand dummy formation pattern DMm) is drawn on substrate SB of the mask(S50). Drawing herein is easily performed in accordance with an ordinarymethod such that the reference position can be indicated without shrink.

The order of the step (S40) and the step (S50) does not matter. The step(S50) may be performed prior to the step (S40), or the step (S40) andthe step (S50) may be performed simultaneously.

The data in the shrink region and the data in the non-shrink region aredrawn on the different layers as in the present embodiment, and thereby,only the data in the shrink region can be shrunk with respect to thedata in the non-shrink region during actual drawing on substrate SB ofmask MSK. In addition, the data in the non-shrink region can be drawn toindicate the ordinary reference position, and thus, easy formation canbe achieved without using a special method. Therefore, there can beprovided high-accuracy mask MSK described in the first and secondembodiments.

(Fourth Embodiment)

A second method for manufacturing mask MSK according to the first andsecond embodiments is as described below. Here as well, a design(layout) method on the CAD, in particular, will be described.

Referring to FIGS. 13 and 14, in the present embodiment, the data forforming pixel pattern PTN1 m in the effective pixel formation region andthe data for forming non-pixel pattern PTN2 m in the reference patternformation region are present in a single layer, for example. However,superimposed only on, for example, the data for forming pixel patternPTN1 m, of these data, is identification data indicating that this datashould be shrunk and formed on substrate SB of mask MSK. Due to thepresence of this identification data, only the data in the shrink regionis controlled and drawn to shrink with respect to the data in thenon-shrink region when patterns PTN1 m and PTN2 m are actually drawn onsubstrate SB.

The present embodiment is different from the aforementioned thirdembodiment in terms of the aforementioned point. The remainingcomponents and the like are similar to those in the third embodiment,and thus, description thereof will not be repeated.

Next, the method for manufacturing mask MSK according to the presentembodiment (design method using the CAD) will be described withreference to FIG. 15.

Referring to FIG. 15, substrate SB for the mask is first prepared (S00).

Next, as shown in FIGS. 13 and 14, prepared is, for example, a singlelayer where the first data for drawing pixel pattern PTN1 m in theeffective pixel formation region (shrink region) and the second data fordrawing non-pixel pattern PTN2 m in the reference pattern formationregion (non-shrink region) are drawn (S10).

Next, the aforementioned first data and second data drawn on the layerprepared in the step (S10) are prepared (S20).

Next, prepared is the identification data for distinguishing between thefirst data for drawing pixel pattern PTN1 m in the effective pixelformation region (shrink region) and the second data for drawingnon-pixel pattern PTN2 m in the reference pattern formation region(non-shrink region) (S30). The identification data specifically refersto the data superimposed only on the first data, for example. By usingthe identification data, the data having the identification datasuperimposed thereon can be identified as the first data, and the datanot having the identification data superimposed thereon can beidentified as the second data. Conversely, the identification datasuperimposed only on the second data may be prepared. In this case, thedata having the identification data superimposed thereon can beidentified as the second data, and the data not having theidentification data superimposed thereon can be identified as the firstdata. In the following description, it is assumed that theidentification data is superimposed on the first data.

Next, the identification data prepared in the step (S30) is superimposedonly on the first data in the shrink region (S40). In other words, theidentification data is drawn to overlap with the first data. As aresult, even when the first data and the second data are present, thedata having the identification data superimposed thereon can be easilyidentified as the first data, and the data not having the identificationdata superimposed thereon can be easily identified as the second data.

Next, with the identification data superimposed only on the first data,pixel pattern PTN1 m (PTN11 m to PTN18 m) is drawn on substrate SB ofthe mask similarly to the step (S40) in FIG. 12 (S50). At this time,pixel pattern PTN1 m is controlled to shrink similarly to the step (S41)in FIG. 12 (S51).

Next, by using the second data that is the data in the non-shrinkregion, non-pixel pattern PTN2 m (reference patterns PTN21 m to PTN28 mand dummy formation pattern DMm) is drawn on substrate SB of the masksimilarly to the step (S50) in FIG. 12 (S60).

Here as well, the order of the step (S50) and the step (S60) does notmatter. The step (S60) may be performed prior to the step (S50), or thestep (S50) and the step (S60) may be performed simultaneously.

As in the present embodiment, the identification data for distinguishingbetween the data in the shrink region and the data in the non-shrinkregion is superimposed on the data in the shrink region. By doing this,only the data in the shrink region can be shrunk with respect to thedata in the non-shrink region during actual drawing on substrate SB ofmask MSK, even when the data in the shrink region and the data in thenon-shrink region are drawn on the same layer. As a result, there can beprovided high-accuracy mask MSK described in the first and secondembodiments.

(Fifth Embodiment)

A third method for manufacturing mask MSK according to the first andsecond embodiments is as described below. Here as well, a design(layout) method on the CAD, in particular, will be described.

Referring to FIGS. 15 and 16, in the present embodiment, two cells of afirst cell CE1 and a second cell CE2 are included in a single layer, forexample. The first cell includes the data (pixel data PTN1) for drawingpixel pattern PTN1 m in the effective pixel formation region (shrinkregion), and the second cell includes the data (non-pixel data PTN2) fordrawing reference pattern PTN2 m in the reference pattern formationregion (non-shrink region).

In other words, the cell for forming the effective pixel formationregion corresponds to cell CE1 in the shrink region, and the cell forforming the reference pattern formation region corresponds to cell CE2in the non-shrink region.

As described above, in the present embodiment, the cells, each of whichis a unit of a collection of smaller data, are included in the layerthat is a collection of data on the CAD.

The present embodiment is different from the aforementioned thirdembodiment in terms of the aforementioned point. The remainingcomponents and the like are similar to those in the third embodiment,and thus, description thereof will not be repeated.

Next, the method for manufacturing mask MSK according to the presentembodiment (design method using the CAD) will be described withreference to FIG. 18.

Referring to FIG. 18, substrate SB for the mask is first prepared (S00).

Next, as shown in FIGS. 16 and 17, prepared is, for example, a singlelayer where the first data for drawing pixel pattern PTN1 m in theeffective pixel formation region (shrink region) and the second data fordrawing reference pattern PTN2 m in the reference pattern formationregion (non-shrink region) are drawn (S10). This step is similar to thestep (S10) in FIG. 15.

Next, first cell CE1 as the cell in the effective pixel formation region(shrink region) and second cell CE2 as the cell in the reference patternformation region (non-shrink region) are drawn on the aforementionedlayer. The first data for drawing pixel pattern PTN1 m in the effectivepixel formation region (shrink region) is drawn in cell CE1 in theshrink region (S20).

The second data for drawing non-pixel pattern PTN2 m in the referencepattern formation region (non-shrink region) is drawn in cell CE2 in thenon-shrink region (S30).

Then, drawing on the substrate of the mask is performed by the processsimilar to the steps (S40), (S41) and (S50) in the third embodiment(FIG. 12), for example (S40 to S50).

Even when the data in the shrink region and the data in the non-shrinkregion are drawn in the different cells in the same layer as in thepresent embodiment, the effect is produced similarly to the effectproduced when the data in the shrink region and the data in thenon-shrink region are drawn on the different layers as in the thirdembodiment, for example. In other words, only the data in the shrinkregion can be shrunk with respect to the data in the non-shrink regionduring actual drawing on substrate SB of mask MSK, and there can beprovided high-accuracy mask MSK described in the first and secondembodiments.

By applying the present embodiment, the data for recognizing the shrinkregion or the non-shrink region is superimposed on the data in the layerin the fourth embodiment, for example. Instead of this, the data forrecognizing the shrink region or the non-shrink region may besuperimposed on the data in the single cell.

(Sixth Embodiment)

A fourth method for manufacturing mask MSK according to the first andsecond embodiments is as described below. Here as well, a design(layout) method on the CAD, in particular, will be described.

Referring to FIGS. 19 and 20, in the present embodiment, the data forforming pixel pattern PTN1 m in the effective pixel formation region andthe data for forming non-pixel pattern PTN2 m in the reference patternformation region are present in a single layer, for example. Acoordinate of a position where each data should be drawn on substrate SBof mask MSK is determined.

In the present embodiment, the first data (data in the shrink region)for drawing pixel pattern PTN1 m in the effective pixel formation regionand the second data (data in the non-shrink region) for drawingnon-pixel pattern PTN2 m in the reference pattern formation region aredistinguished by the coordinate of the position where each data isdrawn. Then, only the data in the shrink region is controlled and drawnto shrink with respect to the data in the non-shrink region.

As shown in FIGS. 19 and 20, for example, when the layer is drawn withina coordinate range of x₁≦x≦x₂ and y₁≦y≦y₂ on mask MSK, the layer isdrawn in the shrink region, and thus, the data can be identified as thefirst data (data in the shrink region). When the layer is drawn outsidethe aforementioned coordinate range on mask MSK, the data can beidentified as the second data (data in the non-shrink region).

In other words, whether the data is the data in the shrink region or notis determined by the identification data superimposed on each data inthe fourth embodiment, whereas whether the data is the data in theshrink region or not is determined by identifying the coordinate of theposition where each data is drawn in the present embodiment.

The present embodiment is different from the aforementioned fourthembodiment in terms of the aforementioned point. The remainingcomponents and the like are similar to those in the fourth embodiment,and thus, description thereof will not be repeated.

Next, the method for manufacturing mask MSK according to the presentembodiment (design method using the CAD) will be described withreference to FIG. 21.

Referring to FIG. 21, substrate SB for the mask is first prepared (S00).

Next, as shown in FIG. 21, the coordinate ranges of the effective pixelformation region (shrink region) and the reference pattern formationregion (non-shrink region) are specified on substrate SB of the mask(S10). As described above, the region within the coordinate range ofx₁≦x≦x₂ and y₁≦y≦y₂ is specified as the shrink region, and the regionwithin the coordinate range other than the aforementioned coordinaterange is specified as the non-shrink region.

Next, prepared is, for example, a single layer where the first data fordrawing pixel pattern PTN1 m in the effective pixel formation region(shrink region) and the second data for drawing non-pixel pattern PTN2 min the reference pattern formation region (non-shrink region) are drawn(S20). This step is similar to the step (S10) in FIG. 15.

Next, the aforementioned first data and second data drawn on the layerprepared in the step (S20) are prepared (S30). This step is similar tothe step (S20) in FIG. 15.

Then, drawing on the substrate of the mask is performed by the processsimilar to the steps (S40), (S41) and (S50) in the third embodiment(FIG. 12), for example (S40 to S50). At this time, while identifying thecoordinate ranges, it is determined whether the data is the data in theshrink region or the data in the non-shrink region. Then, only the datain the shrink region is shrunk and drawing is performed.

As in the present embodiment, the coordinate ranges of the shrink regionand the non-shrink region are specified and identified. By doing this,only the data in the shrink region can also be shrunk with respect tothe data in the non-shrink region during actual drawing on substrate SBof mask MSK, similarly to the other embodiments. As a result, there canbe provided high-accuracy mask MSK described in the first and secondembodiments.

Although the invention made by the inventor of the present invention hasbeen specifically described based on the embodiments, the presentinvention is not limited to the aforementioned embodiments. It isneedless to say that various modifications are possible within a scopeof the general description.

A part of the contents described in the embodiments will be describedbelow although some of them have been already described in theaforementioned embodiments.

(1) A method for manufacturing a mask, including the steps of:

preparing a substrate having a main surface;

preparing first data for drawing a pixel pattern in an effective pixelformation region on the main surface of the substrate where the pixelpattern is formed, the pixel pattern being for forming a pixel componentthat constitutes a pixel;

preparing second data for drawing a reference pattern in a referencepattern formation region on the main surface of the substrate whichsurrounds the effective pixel formation region and where the referencepattern is formed, the reference pattern being for indicating areference position where the pixel pattern should be arranged in theeffective pixel formation region;

preparing identification data for distinguishing between the effectivepixel formation region and the reference pattern formation region;

by using the first data, drawing the pixel pattern in the effectivepixel formation region so as to be displaced from the reference positiontoward a center side of the effective pixel formation region, with theidentification data superimposed on the first data; and

by using the second data, drawing the reference pattern in the referencepattern formation region.

(2) A method for manufacturing a mask, including the steps of:

preparing a substrate having a main surface;

preparing first data drawn in a first cell, the first data being fordrawing a pixel pattern in an effective pixel formation region on themain surface of the substrate where the pixel pattern is formed, thepixel pattern being for forming a pixel component that constitutes apixel;

preparing second data drawn in a second cell different from the firstcell, the second data being for drawing a reference pattern in areference pattern formation region on the main surface of the substratewhich surrounds the effective pixel formation region and where thereference pattern is formed, the reference pattern being for indicatinga reference position where the pixel pattern should be arranged in theeffective pixel formation region;

by using the first data, drawing the pixel pattern in the effectivepixel formation region so as to be displaced from the reference positiontoward a center side of the effective pixel formation region; and

by using the second data, drawing the reference pattern in the referencepattern formation region, wherein

the first cell and the second cell are drawn on the same layer.

(3) A method for manufacturing a mask, including the steps of:

preparing a substrate having a main surface;

specifying coordinate ranges, on the main surface of the substrate, ofan effective pixel formation region on the main surface of the substrateand a reference pattern formation region on the main surface of thesubstrate, the effective pixel formation region being a region where apixel pattern for forming a pixel component that constitutes a pixel isformed, the reference pattern formation region being a region whichsurrounds the effective pixel formation region and where a referencepattern is formed, the reference pattern being for indicating areference position where the pixel pattern should be arranged in theeffective pixel formation region;

preparing first data for drawing the pixel pattern in the effectivepixel formation region and second data for drawing the reference patternin the reference pattern formation region;

by using the first data, drawing the pixel pattern in the effectivepixel formation region so as to be displaced from the reference positiontoward a center side of the effective pixel formation region, whileidentifying the coordinate range; and

by using the second data, drawing the reference pattern in the referencepattern formation region, while identifying the coordinate range.

Although the present invention has been described and illustrated indetail, it is clearly understood that the same is by way of illustrationand example only and is not to be taken by way of limitation, the scopeof the present invention being interpreted by the terms of the appendedclaims.

What is claimed is:
 1. A semiconductor device, comprising: asemiconductor substrate having a main surface; an effective pixel regionarranged on said main surface of said semiconductor substrate; and areference portion arrangement region surrounding said effective pixelregion on said main surface, wherein a light blocking film thatconstitutes a pixel is arranged in said effective pixel region, areference portion for indicating a reference position where said lightblocking film should be arranged in said effective pixel region isarranged in said reference portion arrangement region, and said lightblocking film is arranged to be displaced from said reference positiontoward a center side of said effective pixel region, wherein the lightblocking film is formed in a first layer and the reference portion isformed in a second layer.
 2. The semiconductor device according to claim1, wherein in said reference portion arrangement region, a dummystructure is formed around said reference portion so as to be spacedapart from said reference portion.
 3. The semiconductor device accordingto claim 1, wherein said reference portion is arranged to face saidlight blocking film with an outer perimeter line in said effective pixelregion interposed therebetween, and said reference portion is arrangedto indicate said reference position in a direction along said outerperimeter line where said light blocking film facing said referenceportion should be arranged.
 4. The semiconductor device according toclaim 3, wherein said reference portion has a planar shape that issymmetric with respect to an imaginary straight line as a symmetric lineextending perpendicularly to said outer perimeter line on said mainsurface.
 5. The semiconductor according to claim 1, wherein the lightblocking film constitutes a plurality of pixels.
 6. The semiconductoraccording to claim 5, wherein spacing between the pixels constituted bythe light blocking film is smaller than spacing between patterns withinthe reference pattern.
 7. A semiconductor device, comprising: asemiconductor substrate including an effective pixel region surroundedby a reference portion region; a light blocking film defining locationsof pixels in the effective pixel region; and a reference portionarranged in the reference portion region, the reference portionindicating a position where the light blocking film should be arranged,wherein the light blocking film is a first layer of the semiconductor,and the reference portion is a second layer of the semiconductor device.8. The semiconductor according to claim 7, wherein spacing between thepixels defined by the light blocking film is smaller than spacingbetween patterns within the reference pattern.